Flex and Rigid-Flex substrate are becoming common in areas like IoT, wearables, mobile smart devices, medical devices, automotive and consumers. Come and see how OrCAD PCB handle multiple cross-section materials within different stackups in one design, an area-dependent rules with real-time inter-layer checks to meet rigid-flex manufacturing guidelines that help you to avoid costly fabrication errors, a new flex focus automatic arc routing and a 3D flex bend editor that gives the designer the necessary tools to manage and visualize these complex designs.