The annual Electronic Packaging, Electro–Mechanical Solutions & 3D Printing, 2019 Conference and Trade Fair will deal with providing various solutions for electronic system packaging, will present innovations and solutions for connecting mother boards, environmentally friendly innovations and solutions for server farm racks, packaging for vehicles, commercial and military packaging, racks and cabins for communication applications and for special environmental conditions, packaging materials, fasteners, solutions for heat removal and cooling in racks and packages, industrial designing, content tools, simulation, analysis and environmental test innovations, machining of metal and plastic parts, standardisation services and moreSenior lecturers from the industry and the academy, as well as guest lecturers from around the world, will take part in the conference giving lectures and presenting innovations in the packaging field, innovations in the material, coating and colouring fields, packaging solutions for special applications, production and speed modelling technologies, heat removal and cooling, electromagnetic compliance, RFI, EMC and EMI and more.

Dozens of manufacturers, dealers, representatives, subcontractors, industrial designers, consultants and suppliers of fasteners will present at the trade fair.

The conference and trade fair attendees will have the opportunity to meet in one day the vast majority of major partners who are active in the electronic packaging and electro–mechanical solution fields.

Admission to the conference and to the trade fair is free of charge; nevertheless, registration in advance is required

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RAFAEL
INCOMAC
  • ELECTRONIC PACKAGING, ELECTRO–MECHANICAL SOLUTIONS & 3D DAY | 19-11-2019
  • ELECTRONIC PACKAGING, ELECTRO–MECHANICAL SOLUTIONS & 3D DAY | Among The Lectures:
Mr. Yitzik Lilo | Marketing & Business Develoment Manager – INCOMAC
Prima Power Servo-Electric EBe Automates the Bending Process of High-Quality Sheet Meta

Mr. David R. | Chief research engineer – Rafael
Creative Solutions in Electronic Packaging

Mr. David Kidron | System Engineering Manager – Alexander Schneider
Design of Shelters and Ground Systems

Mr. David V. | Chief research engineer – Rafael
Use of Commercial Connectors in Military Systems

Major Oren Niv | Head of the Content Analysis – Departmentת IDF

Mr. Michael A. | Rafael
Advanced Conformal Coatings

Mr. Michael Shlenkevich | NPI Leader and Special Projects -Kanfit Ltd
Manufacturing Pprocesses for Composite Components for Aerospace Applications

Dr. Alexander Golod | Freelance Consultant
Fatigue Strength and Llife Expectancy, Calculations and Testing of" 3D Printing Components and structures

Mr. Tomer Avraham | Thermal and CFD Specialist – Tenzor ANSYS CP
Reduced Order Models (ROMs) for Optimization, Design and System Engineering

Autodesk
TBD

  • ההרצאות עשויות להשתנות בכפוף להחלטת החברה המארגנת**
LAST YEAR EVENT