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  • ORCAD – ALLEGRO – SIGRITY | USER GROUP EVENT
  • Morning sessions (PCB Design)
  • Afternoon session (PCB Analysis)
OrCAD PCB Design Product solutions and latest Capabilities (60min)
This session will present an overview of the Cadence OrCAD PCB design and analysis solutions including the latest 2018 capabilities in OrCAD Capture/CIS/CIP/PSpice and Ultra Librarian which comes with millions of pre-built PCB parts from major manufacturers. The new OrCAD Capture integrated schematic constraint manager will be introduce including many other new features like the industry’s first PCB design and verification flow to achieve “Fit for Purpose - Tool Confidence Level 1 (TCL1)” certification enables you to meet stringent ISO 26262 automotive safety requirements.

PCB Real time analysis in OrCAD/Allegro PCB Designer (25min)
To complete a working design, you need to run a series of signoff checks before you can call it done. The best designers already know what errors the analysis tools will throw at them before running signoff checks. The New OrCAD and Real-Time PCB Design makes it possible for everyone to design high-speed boards, for everyone to be improve the manufacturability of their designs, and for everyone to create the next generation of high-performance high-density electronics. Use real-time design insights in OrCAD to go from prototype to production in less time, with fewer re-spins. Including Real-Time high-speed signal checking, Real-Time impedance, Real-Time coupling, Real-Time Routing, Real-Time Placement, Dynamic Differential Pair Phase Control, Accurate delay modeling from die to die, Z-axis delay, Advance Real-Time back-drilling rules and checks for clearances.

OrCAD PCB 3D design environment and MCAD-ECAD seamless integration (25min)
Come and see the OrCAD PCB 3D environment that gives you the ability to see a realistic 3D representation of your design including complex via structures, stackups and isolated sections of the board, mechanical elements and enclosures for true visualization. The environment support 3D placements, 3D checking to detect clashes , 3D flex folding, 3D printing and a lots more. In addition this session will present a seamless co-design integration to ECAD-MCAD mechanical systems supporting IPC-2581/STEP/IDF/IDX implementing an advance push-pull model to eliminate file handling.

Come and see the OrCAD PCB 3D environment that gives you the ability to see a realistic 3D representation of your design including complex via structures, stackups and isolated sections of the board, mechanical elements and enclosures for true visualization. The environment support 3D placements, 3D checking to detect clashes , 3D flex folding, 3D printing and a lots more. In addition this session will present a seamless co-design integration to ECAD-MCAD mechanical systems supporting IPC-2581/STEP/IDF/IDX implementing an advance push-pull model to eliminate file handling.

Flex design in OrCAD PCB Design and 3D implementation (25min)
Flex and Rigid-Flex substrate are becoming common in areas like IoT, wearables, mobile smart devices, medical devices, automotive and consumers. Come and see how OrCAD PCB handle multiple cross-section materials within different stackups in one design, an area-dependent rules with real-time inter-layer checks to meet rigid-flex manufacturing guidelines that help you to avoid costly fabrication errors, a new flex focus automatic arc routing and a 3D flex bend editor that gives the designer the necessary tools to manage and visualize these complex designs.

Flex and Rigid-Flex substrate are becoming common in areas like IoT, wearables, mobile smart devices, medical devices, automotive and consumers. Come and see how OrCAD PCB handle multiple cross-section materials within different stackups in one design, an area-dependent rules with real-time inter-layer checks to meet rigid-flex manufacturing guidelines that help you to avoid costly fabrication errors, a new flex focus automatic arc routing and a 3D flex bend editor that gives the designer the necessary tools to manage and visualize these complex designs.

Advance RF design technology in OrCAD/Allegro PCB design (25min)
PCB designers face significant challenges in integrating RF circuits on a mixed-signal design. Today’s advanced designs are more complex and need to incorporate all design portions such as digital, RF/microwave, and analog circuits on the same board. This session will present an RF design productivity of up to %50 and more using a robust set of layout functionalities to handle complex RF designs like the creation and editing of via arrays and RF etch elements that are parameterized to enable their use in RF circuit design creation including an existing library of more than 600 such parameterized elements from microstrip to stripline to lumped components. And the Flexible Shape Editor (FSE) module that includes a robust set of editing functionality to provides a powerful and flexible adjustment/resizing functions for copper editing to modify RF irregular shapes that used heavily in power amplifier and filter circuits. Also will discuss the interfaces with RF simulation tools like ADS

PCB designers face significant challenges in integrating RF circuits on a mixed-signal design. Today’s advanced designs are more complex and need to incorporate all design portions such as digital, RF/microwave, and analog circuits on the same board. This session will present an RF design productivity of up to %50 and more using a robust set of layout functionalities to handle complex RF designs like the creation and editing of via arrays and RF etch elements that are parameterized to enable their use in RF circuit design creation including an existing library of more than 600 such parameterized elements from microstrip to stripline to lumped components. And the Flexible Shape Editor (FSE) module that includes a robust set of editing functionality to provides a powerful and flexible adjustment/resizing functions for copper editing to modify RF irregular shapes that used heavily in power amplifier and filter circuits. Also will discuss the interfaces with RF simulation tools like ADS

Real-Time Design for Manufacturability (DFM) in OrCAD/Allegro PCB design (25min)
Post-design DFM checks are too late. Even if you’re able to find a mistake, you’re going to lose hours, days, even weeks adjusting your design. Explore with us OrCAD full DFM, Design for Fabrication (DFF), Design for Assembly (DFA), and Design for Test (DFT) checks that you need in real-time while you design, so you can complete your design fast and signoff with confidence.

Post-design DFM checks are too late. Even if you’re able to find a mistake, you’re going to lose hours, days, even weeks adjusting your design. Explore with us OrCAD full DFM, Design for Fabrication (DFF), Design for Assembly (DFA), and Design for Test (DFT) checks that you need in real-time while you design, so you can complete your design fast and signoff with confidence.

Differential pairs Return Path Vias design and analysis (25min)
High Density Interconnect layout routing techniques using advanced set of design rules. Explore a very simple way to perform a pre-and post-layout analysis for vias in SerDes topology. We will demonstrate a full-wave 3D Electromagnetic Field Solver to extract parasitic models of 3D via to build more realistic via structures.

PSpice System Design and Mathlab (25min)
The PSpice® Systems Option provides designers with a system-level simulation solution for their designs supporting C/C++/SystemC, and Verilog A-ADM. Designers utilize PSpice simulation programs for accurate analog and mixed-signal simulations supported by a wide range of board-level models. MATLAB Simulink is a platform for multi-domain simulation and model-based design of dynamic systems. PSpice® Systems Option combines industry-leading simulation tools to provide co-simulations, simulation optimizations, parasitic extraction and re-simulation techniques

The PSpice® Systems Option provides designers with a system-level simulation solution for their designs supporting C/C++/SystemC, and Verilog A-ADM. Designers utilize PSpice simulation programs for accurate analog and mixed-signal simulations supported by a wide range of board-level models. MATLAB Simulink is a platform for multi-domain simulation and model-based design of dynamic systems. PSpice® Systems Option combines industry-leading simulation tools to provide co-simulations, simulation optimizations, parasitic extraction and re-simulation techniques

SerDes compliance kits with Sigrity SystemSI (25min)
We will explore the use of Compliance Kit for PCIe 4, USB3, SFP+, MIPI, HDMI and more.These kits come preloaded with various compliance test bench templates to help sign-off analysis get started very quickly. The major compliance checks are built in the compliance kit, eliminating all the work setting up the simulation test criteria.

We will explore the use of Compliance Kit for PCIe 4, USB3, SFP+, MIPI, HDMI and more.These kits come preloaded with various compliance test bench templates to help sign-off analysis get started very quickly. The major compliance checks are built in the compliance kit, eliminating all the work setting up the simulation test criteria.

DDR4 design analysis with Sigrity SystemSI (25min)
DDR4 is common high-speed source-synchronous interface. Explore with us DDR4 post-layout simulations with non-ideal power conditions. Synchronous design performance metrics including eye diagrams with detailed timing measurements and compliance kits vs JEDEC standard are available as outputs.

DDR4 is common high-speed source-synchronous interface. Explore with us DDR4 post-layout simulations with non-ideal power conditions. Synchronous design performance metrics including eye diagrams with detailed timing measurements and compliance kits vs JEDEC standard are available as outputs.

Power Delivery Network optimization with Sigrity analysis solution (25min)
Ensure you get high performance at a system and component level and at the same time save between 15% and 50% in decoupling capacitor (decap) costs. Cadence Sigrity OptimizePI technology does a complete AC frequency analysis of boards and IC packages. Supporting both pre- and post-layout studies, it quickly pinpoints the best decap selections and placement locations to meet your power-delivery network (PDN) needs at the lowest possible cost.

Ensure you get high performance at a system and component level and at the same time save between 15% and 50% in decoupling capacitor (decap) costs. Cadence Sigrity OptimizePI technology does a complete AC frequency analysis of boards and IC packages. Supporting both pre- and post-layout studies, it quickly pinpoints the best decap selections and placement locations to meet your power-delivery network (PDN) needs at the lowest possible cost.

Sigrity PowerDC Electrical/thermal co-simulation to maximize accuracy (25min)
Ensure reliable power delivery within electrical/thermal co-simulation to maximize accuracy. Cadence Sigrity PowerDC technology provides efficient DC analysis for signoff of IC package and PCB designs. PowerDC technology quickly pinpoints excessive IR drop, along with areas of excess current density and thermal hotspots to minimize your design’s risk of field failure.

Ensure reliable power delivery within electrical/thermal co-simulation to maximize accuracy. Cadence Sigrity PowerDC technology provides efficient DC analysis for signoff of IC package and PCB designs. PowerDC technology quickly pinpoints excessive IR drop, along with areas of excess current density and thermal hotspots to minimize your design’s risk of field failure.