ELECTRONIC PACKAGING, ELECTRO–MECHANICAL SOLUTIONS & 3D DAY

ELECTRONIC PACKAGING, ELECTRO–MECHANICAL SOLUTIONS & 3D DAY 

The Electronic Packaging, Electro–Mechanical Solutions & 3D Printing Conference and Exhibition will take place on OCT 13, 2026, alongside the Military & Aviation Exhibition. This event is exclusively designed for industry professionals – engineers, project managers, manufacturing and engineering experts, and procurement specialists.

Cutting-Edge Innovations & Solutions

This leading event will showcase the latest technologies and solutions in:

• Electronic packaging & interconnect technologies | Eco-friendly and advanced server racks | Military, commercial & automotive packaging | Thermal management & cooling solutions | Industrial design, simulation & environmental testing | Metal & plastic machining, fasteners & standardization

Expert-Led Conference Sessions

Industry leaders and global experts will present cutting-edge innovations in:

• Smart packaging materials & coatings | 3D printing & rapid prototyping | EMC, EMI & RFI compliance | Customized packaging for extreme conditions

Meet the Industry Leaders – All in One Day!

The exhibition will feature leading manufacturers, suppliers, and solution providers, offering unique networking and business opportunities.

Admission is free, but prior registration is required.

TARGET AUDIENCE

R&D Engineers • Mechanical Engineers • Electronics Engineers • Design Engineers • Manufacturing Engineers • Quality & Reliability Engineers • Engineering Managers • Purchasing Professionals, employed by Defense & Aerospace companies, Medical Device companies, and companies engaged in the development and manufacturing of electronic and electro-mechanical systems.