The annual Electronic Packaging and Electro–Mechanical Solutions, 2017 Conference and Trade Fair will deal with providing various solutions for electronic system packaging, will present innovations and solutions for connecting mother boards, environmentally friendly innovations and solutions for server farm racks, packaging for vehicles, commercial and military packaging, racks and cabins for communication applications and for special environmental conditions, packaging materials, fasteners, solutions for heat removal and cooling in racks and packages, industrial designing, content tools, simulation, analysis and environmental test innovations, machining of metal and plastic parts, standardisation services and moreSenior lecturers from the industry and the academy as well as guest lecturers from around the world will take part in the conference giving lectures and presenting innovations in the packaging field, innovations in the material, coating and colouring fields, packaging solutions for special applications, production and speed modelling technologies, heat removal and cooling, electro–magnetic compliance, RFI, EMC and EMI and more.

Dozens of manufacturers, dealers, representatives, sub–contractors, industrial designers, consultants and suppliers of fasteners will present in the trade fair.

The conference and trade fair attendees will have the opportunity to meet in one day the vast majority of major partners who are active in the electronic packaging and electro–mechanical solution fields.

Admission to conference and to the trade fair is free of charge; nevertheless registration in advance is required

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Meet Our Exhibitors

MOLEX
    YAMA
      TELSYS
        AGY
          AVRON
            BAR-TEC
              BTI 2XL
                CHEMOGRAF
                  CHINA DIRECT
                    EL KAM
                      DIGITAL CUT
                        MAHAM
                          MOSTECH
                            KAHANE
                              S2P
                                SCHWARCZ TOOLS
                                  SE-PROF
                                      SURON
                                        TEDER
                                          WURTH
                                            YAAD
                                              ARAN
                                                ARTEK
                                                  ALEXANDER SCHNEIDER
                                                    MGR
                                                      ICPC
                                                        ELECTRONDART
                                                            • ELECTRONIC PACKAGING SOLUTIONS 2017
                                                            • Conference Hall
                                                            Mr. Amos Friedman | ARAN Research and Development
                                                            Design for Additive Manufacturing

                                                            Mr. Eli Avital | ECI / Qaulitech
                                                            Enclosure Sealing Standards and Testing

                                                            Mrs. Shoshi Ben-Maor | Elta

                                                            Mrs. Havatzelet Shmueli | Rafael

                                                            Mrs. Natali Balmegia | Rafael

                                                            Mrs. Dina Baron | Elta

                                                            Dr. Sivan Natan Knaz | Heat transfer and CFD Expert

                                                            Mr. Avi Yaverboim | nanoplate
                                                            New approach to EMI shielding – electroplating of 3D printed objects

                                                            Mr.Koby Hollander | Elbit systems
                                                            4 keys for a winning selection of a sub-contractor

                                                            Mr. Ilan Sadon | Igos mn
                                                            RF Shielding – Guidelines

                                                            LAST YEAR EVENT